{"product_id":"rapid-thermal-processing-for-future-semiconductor-devices","title":"Rapid Thermal Processing for Future Semiconductor Devices","description":"This volume is a collection of papers which were presented at the 2001 International Conference on Rapid Thermal Processing (RTP 2001) held at Ise Shima, Mie, on November 14-16, 2001. This symposium is second conference followed the previous successful first International RTP conference held at Hokkaido in 1997. The RTP 2001 covered the latest developments in RTP and other short-time processing continuously aiming to point out the future direction in the Silicon ULSI devices and II-VI, III-V compound semiconductor devices.\u003cbr\u003e\u003cbr\u003eThis book covers the following areas: advanced MOS gate stack, integration technologies, advancd channel engineering including shallow junction, SiGe, hetero-structure, novel metallization, inter-connect, silicidation, low-k materials, thin dielectrics including gate dielectrics and high-k materials, thin film deposition including SiGe, SOI and SiC, process and device modelling, Laser-assisted crystallization and TFT device fabrication technologies, temperature monitoring and slip-free technologies.\u003cbr\u003e","brand":"Elsevier S \u0026 T","offers":[{"title":"perpetual","offer_id":45039607152737,"sku":"9780444513397","price":53.75,"currency_code":"KWD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0268\/9869\/4241\/files\/480_900b39c3-2659-4efc-84ba-5bc7a7f7a8e7.jpg?v=1779490836","url":"https:\/\/ebooks.aafaqeducation.com\/products\/rapid-thermal-processing-for-future-semiconductor-devices","provider":"ebook.aafaqeducation","version":"1.0","type":"link"}