Elsevier S & T

Direct-Write Technologies for Rapid Prototyping Applications: Sensors, Electronics, and Integrated Power Sources

Pique, Alberto; Chrisey, Douglas B.

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Table of contents
  • Contentsvii
  • Prefacexix
  • Contributorsxxiii
  • Chapter 1. Introduction to Direct-Write Technologies for Rapid Prototyping1
  • 1. Direct-Write Technologies1
  • 2. Electronics3
  • 3. Biomaterials9
  • 4. Miscellaneous Application Areas11
  • 5. Conclusions11
  • Part I: Applications15
  • Chapter 2. Overview of Commercial and Military Application Areas in Passive and Active Electronic De17
  • 1. Introduction17
  • 2. Direct-Write Electronic Component Manufacturing18
  • 3. Making Direct-Write Processes a Reality20
  • 4. Applications of Direct-Write Manufacturing24
  • 5. Conclusions29
  • Chapter 3. Role of Direct-Write Tools and Technologies for Microelectronic Manufacturing33
  • 1. Introduction33
  • 2. Direct-Write Technology in the Microelectronics Industry35
  • 3. Next Generation System46
  • 4. Technology Diffusion in Microelectronic Industry50
  • 5. Conclusions54
  • Chapter 4. Direct-Write Materials and Layers for Electrochemical Power Devices55
  • 1. Introduction55
  • 2. Background57
  • 3. Need for Direct-Write Layers63
  • 4. Materials for Metal-Air Batteries and PEM Fuel Cells76
  • 5. Direct-Write Layers for Battery and Fuel Cell Applications80
  • 6. Conclusions91
  • Chapter 5. The Role of Direct Writing for Chemical and Biological Materials: Commercial and Military93
  • 1. Introduction93
  • 2. Chemical Microsensors97
  • 3. Biosensors and Microwell Technology .103
  • 4. Coating Techniques for Sensing Applications106
  • 5. Case Studies111
  • 6. Summary116
  • Part II: Materials121
  • Chapter 6. Advanced Materials Systems for Ultra-Low- Temperature, Digital, Direct-Write Technologies123
  • 1. Introduction123
  • 2. Deposition Methods and Associated Materials Requirements133
  • 3. Super-Low-Fire Inks and Pastes141
  • 4. Conductors157
  • 5. Resistors158
  • 6. Dielectrics and Ferrites160
  • 7. Phosphor Materials for Information Display Technologies166
  • 8. Materials for Metal-Air Batteries and Proton Exchange Membrane Fuel Cells170
  • 9. Conclusions172
  • Part III: Direct-Write Techniques175
  • Chapter 7. Direct Write Using Ink-Jet Techniques177
  • 1. Introduction177
  • 2. History178
  • 3. Background on Ink-Jet Technology178
  • 4. Jetting Materials183
  • 5. Pattern/Image Formation: Fluid/Substrate Interaction185
  • 6. Throughput Considerations190
  • 7. Direct-Write Applications190
  • 8. Commercial Systems219
  • 9. Future Trends222
  • 10. Summary223
  • Chapter 8. Micropen Printing of Electronic Components229
  • 1. Introduction229
  • 2. The Micropen230
  • 3. Rheological Characteristics of Thick-Film Pastes232
  • 4. Prototyping of Components from Commercial Slurries249
  • 5. Summary256
  • Chapter 9. Direct Write Thermal Spraying of Multilayer Electronics and Sensor Structures261
  • 1. Introduction261
  • 2. Process Description265
  • 3. Materials and Microstructural Characteristics268
  • 4. Multilayer Electronic Circuits and Sensors by Thermal Spray291
  • 5. Fine Feature Deposition by Direct-Write Thermal Spray294
  • 6. Summary299
  • Chapter 10. Dip-Pen Nanolithography: Direct Writing Soft Structures on the Sub-100-Nanometer-Length303
  • 1. Introduction303
  • 2. Scanning Probe Microscope Methods304
  • 3. Dip-Pen Nanolithography Methods304
  • 4. Future Issues310
  • Chapter 11. Nanolithography with Electron Beams: Theory and Practice313
  • 1. Introduction313
  • 2. The Areal Image318
  • 3. Conventional Probe-Forming E-Beam Tools318
  • 4. Mathematical Approaches to Proximity Control331
  • 5. Summary and Conclusions344
  • Chapter 12. Focused Ion Beams for Direct Writing347
  • 1. Introduction347
  • 2. Equipment348
  • 3. Ion Solid Interaction353
  • 4. Applications369
  • 5. Conclusions376
  • Chapter 13. Laser Direct-Write Micromachining385
  • 1. Introduction385
  • 2. Trends in Microfabrication387
  • 3. Overview of Laser-Matter Interactions387
  • 4. Laser Micromachining394
  • 5. Summary412
  • Chapter 14. 3D Microengineering via Laser Direct-Write Processing Approaches415
  • 1. Introduction415
  • 2. The Laser Direct-Write 3D Processing Tool419
  • 3. Laser Material Interaction Physics421
  • 4. Topics Relevant to 3D Laser Microengineering433
  • 5. 3D Microfabrication by 2D Direct-Write Patterning Approaches438
  • 6. Direct-Write Volumetric (3D) Patterning448
  • 7. Tailoring the Material to Advantage460
  • 8. Summary and Conclusions462
  • Chapter 15. Flow- and Laser-Guided Direct Write of Electronic and Biological Components475
  • 1. Motivation475
  • 2. Fundamentals477
  • 3. Material Results482
  • 4. Electronic Components486
  • 5. Future Work487
  • 6. Conclusion488
  • Chapter 16. Laser-Induced Forward Transfer: An Approach to Single-Step Microfabrication493
  • 1. An Overview of the Laser-Induced Forward Transfer Process493
  • 2. Deposition of Single Elements496
  • 3. Deposition of Oxide Compounds500
  • 4. Transfer Mechanisms504
  • 5. Applications of LIFT509
  • 6. Summary and Conclusions514
  • Chapter 17. Matrix Assisted Pulsed Laser Evaporation-Direct Write (MAPLE-DW): A New Method to Rapidl517
  • 1. Introduction518
  • 2. Background519
  • 3. Matrix Assisted Pulsed Laser Evaporation-Direct Write521
  • 4. MAPLE-DW of Inorganic Materials530
  • 5. MAPLE-DW of Organic and Biomaterials543
  • 6. Summary and Future Work550
  • Part IV: Comparison to Other Approaches to Pattern Material555
  • Chapter 18. Technologies for Micrometer and Nanometer Pattern and Material Transfer557
  • 1. Introduction558
  • 2. Applications of Pattern Transfer Technologies563
  • 3. Overview of Pattern Transfer Technologies572
  • 4. Optical Lithographies583
  • 5. Extreme Ultraviolet Lithography589
  • 6. X-ray Lithography593
  • 7. Particle Lithographies596
  • 8. Proximal Probe Lithography599
  • 9. Other Pattern Transfer Methods603
  • 10. Applications of Material Transfer Technologies609
  • 11. Overview of Material Transfer Technologies612
  • 12. Fixed Pattern Subtractive Techniques615
  • 13. Programmable Subtractive Techniques621
  • 14. Fixed Pattern Additive Material Transfer Methods625
  • 15. Programmable Additive Liquid Methods628
  • 16. Beam-Based Programmable Additive Techniques639
  • 17. Other Programmable Additive Technologies645
  • 18. Three-Dimensional Rapid Microprototyping650
  • 19. Molding and Related Technologies655
  • 20. Pattern and Material Transfer by Self-Assembly665
  • 21. Comparison of Pattern and Material Transfer Techniques671
  • 22. Conclusion674
  • Appendix A: Ancillary Techniques680
  • Radiation Sources680
  • Masks681
  • Stage Motion and Pattern Alignment681
  • Materials for Thin Films683
  • Processes for Thin Films685
  • Characterization of Materials and Tools686
  • Metrology and Inspection of Patterns and Structures687
  • Packaging688
  • Permissions700
  • Index702
Book details
  • Vendor Elsevier S & T
  • SKU 9780121742317
  • ISBN-13 9780080504643
  • Author Pique, Alberto; Chrisey, Douglas B.
  • Category Technology & Engineering
  • Subject Materials Science

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Direct-Write Technologies covers applications, materials, and the techniques in using direct-write technologies. This book provides an overview of the different direct write techniques currently available, as well as a comparison between the strengths and special attributes for each of the techniques. The techniques described open the door for building prototypes and testing materials. The book also provides an overview of the state-of-the-art technology involved in this field. Basic academic researchers and industrial development engineers who pattern thin film materials will want to have this text on their shelves as a resource for specific applications. Others in this or related fields will want the book to read the introductory material summarizing isuses common to all approaches, in order to compare and contrast different techniques. Everyday applications include electronic components and sensors, especially chemical and biosensors.

There is a wide range of research and development problems requiring state-of-the-art direct write tools. This book will appeal to basic researchers and development engineers in university engineering departments and at industrial and national research laboratories. This text should appeal equally well in the United States, Asia, and Europe.

Both basic academic researchers and industrial development engineers who pattern thin film materials will want to have this text on their shelves as a resource for specific applications.

This book provides

An overview of the different direct write techniques currently available
A comparison between the strengths and special attributes for each of the techniques
An overview of the state-of-the-art technology involved in this field.