Low Temperature Electronics: Physics, Devices, Circuits, and Applications
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Table of contents
- Contentsv
- Forewordix
- General Overviewxi
- Chapter 1. Physics of Silicon at Cryogenic Temperatures1
- 1.1 Introduction1
- 1.2 Energy Distribution and Charge Carriers2
- 1.3 Semiconductor Surface-Related Phenomena41
- 1.4 Charge Ionization53
- 1.5 Thermal Properties and Electrothermal Effects70
- 1.6 Optical Properties85
- 1.7 Conclusions94
- References96
- Chapter 2. Silicon Devices and Circuits105
- 2.1 Introduction105
- 2.2 The Bulk MOS Transistor106
- 2.3 The Silicon-on-Insulator MOS Transistor157
- 2.4 The Bipolar Transistor185
- 2.5 Radiation Detectors194
- 2.6 Circuits211
- 2.7 Conclusions239
- References240
- Chapter 3. Reliability Aspects of Cryogenic Silicon Technologies259
- 3.1 Introduction259
- 3.2 High Electrical Field Transport Phenomena in Si at Cryogenic Temperatures260
- 3.3 Avalanche and Breakdown Effects in Si Resistors and Bipolar Devices at Low Temperature274
- 3.4 Avalanche and Breakdown Phenomena in Cryogenic MOSFETs290
- 3.5 Hot Carrier Degradation and Reliability at Low Temperatures331
- 3.6 Conclusions358
- References359
- Chapter 4. Radiation Effects and Low-Frequency Noise in Silicon Technologies385
- 4.1 Introduction385
- 4.2 Radiation Effects at Low Temperature387
- 4.3 Low-Frequency Noise at Cryogenic Temperatures430
- 4.4 Conclusions485
- References489
- Chapter 5. Heterostructure and Compound Semiconductor Devices511
- 5.1 Introduction511
- 5.2 GaAs Field-Effect Transistors521
- 5.3 High Electron Mobility Transistors541
- 5.4 Heterojunction Bipolar Transistors558
- 5.5 Resonant Tunneling Diodes578
- 5.6 Circuits and Applications617
- Acknowledgments626
- References626
- Chapter 6. Compound Heterostructure Semiconductor Lasers and Photodetectors647
- 6.1 Introduction647
- 6.2 Compound Semiconductor Lasers649
- 6.3 InP / InGaAs Avalanche Photodiodes736
- 6.4 Quantum Well Infrared Photodetectors758
- 6.5 PIN and Other Photodetectors and Cryogenic Application Systems801
- Acknowledgments811
- References811
- Chapter 7. High-Temperature Superconductor/Semiconducto r Hybrid Microwave Devices and Circuits841
- 7.1 Introduction841
- 7.2 High-Temperature Superconducting Films: Fabrication and Characterization843
- 7.3 Filters865
- 7.4 Antennas866
- 7.5 Oscillators871
- 7.6 Hybrid Superconductor/Semiconductor Receiver Front Ends878
- 7.7 Conclusions888
- References889
- Chapter 8. Cryocooling and Thermal Management901
- 8.1Introduction901
- 8.2 Obtainment of Cryogenic Liquids902
- 8.3 Fundamentals of Cryogenic Processes903
- 8.4 Basic Cooling Methods907
- 8.5 Thermoelectronic Cooling913
- 8.6 Generation of Ultralow Cryogenic Temperatures915
- 8.7 Cryostats920
- 8.8 Thermal Management925
- 8.9 Conclusions931
- References934
- Chapter 9. Applications, Trends, and Perspectives935
- Index953
Low Temperature Electronics: Physics, Devices, Circuits, and Applications summarizes the recent advances in cryoelectronics starting from the fundamentals in physics and semiconductor devices to electronic systems, hybrid superconductor-semiconductor technologies, photonic devices, cryocoolers and thermal management. Furthermore, this book provides an exploration of the currently available theory, research, and technologies related to cryoelectronics, including treatment of the solid state physical properties of the materials used in these systems.
Current applications are found in infrared systems, satellite communications and medical equipment. There are opportunities to expand in newer fields such as wireless and mobile communications, computers, and measurement and scientific equipment. Low temperature operations can offer certain advantages such as higher operational speeds, lower power dissipation, shorter signal transmission times, higher semiconductor and metal thermal conductivities, and improved digital and analog circuit performance.
The computer, telecommunication, and cellular phone market is pushing the semiconductor industry towards the development of very aggressive device and integrated circuit fabrication technologies. This is taking these technologies towards the physical miniaturization limit, where quantum effects and fabrication costs are becoming a technological and economical barrier for further development. In view of these limitations, operation of semiconductor devices and circuits at low temperature (cryogenic temperature) is studied in this book.
* It is a book intended for a wide audience: students, scientists, technology development engineers, private companies, universities, etc.
* It contains information which is for the first time available as an all-in-one source; Interdisciplinary material is arranged and made compatible in this book
* It is a must as reference source
Current applications are found in infrared systems, satellite communications and medical equipment. There are opportunities to expand in newer fields such as wireless and mobile communications, computers, and measurement and scientific equipment. Low temperature operations can offer certain advantages such as higher operational speeds, lower power dissipation, shorter signal transmission times, higher semiconductor and metal thermal conductivities, and improved digital and analog circuit performance.
The computer, telecommunication, and cellular phone market is pushing the semiconductor industry towards the development of very aggressive device and integrated circuit fabrication technologies. This is taking these technologies towards the physical miniaturization limit, where quantum effects and fabrication costs are becoming a technological and economical barrier for further development. In view of these limitations, operation of semiconductor devices and circuits at low temperature (cryogenic temperature) is studied in this book.
* It is a book intended for a wide audience: students, scientists, technology development engineers, private companies, universities, etc.
* It contains information which is for the first time available as an all-in-one source; Interdisciplinary material is arranged and made compatible in this book
* It is a must as reference source