Elsevier S & T

Micro Mechanical Transducers: Pressure Sensors, Accelerometers and Gyroscopes

Bao, Min-hang

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Table of contents
  • Cover
  • Contentsix
  • Prefacevii
  • Chapter 1. Introduction to micro mechanical transducers1
  • 1.1. Piezoresistive pressure sensors1
  • 1.2. Piezoresistive accelerometers5
  • 1.3. Capacitive sensors9
  • 1.4. Resonant sensors13
  • 1.5. Vibratory gyroscopes15
  • 1.6. Basic principles of micro mechanical transducers19
  • References20
  • Chapter 2. Basic mechanics of beam and diaphragm structures23
  • 2.1. Stress and Strain24
  • 2.2. Stress and strain of beam structures32
  • 2.3. Vibration frequency by energy method44
  • 2.4.Vibration frequencies of beam by differential equation method55
  • 2.5. Damped and forced vibration64
  • 2.6. Basic mechanics of diaphragms75
  • References87
  • Chapter 3. Air damping89
  • 3.1. Viscous flow of a fluid89
  • 3.2. Squeeze-film air damping99
  • 3.3. Slide-film air damping123
  • 3.4. Damping in rare air133
  • References137
  • Chapter 4. Electrostatic driving and capacitive sensing139
  • 4.1. Electrostatic force140
  • 4.2. Displacement of elastic structures by electrostatic force147
  • 4.3. Step and alternating driving165
  • 4.4. Capacitive sensing177
  • 4.5. Effects of electric driving on capacitive sensing187
  • References197
  • Chapter 5. Piezoresistive sensing199
  • 5.1. Metal strain gauge199
  • 5.2. Piezoresistive effect of silicon201
  • 5.3. Coordinate transformation of tensors of the second rank206
  • 5.4. Coordinate transformation of piezoresistive coefficient214
  • 5.5. Piezoresistive sensing elements219
  • 5.6. Polysilicon piezoresistive sensing elements229
  • References239
  • Chapter 6. Piezoresistive pressure transducers241
  • 6.1. Designs with flat diaphragms241
  • 6.2. Pressure transducers with sculptured diaphragm structure247
  • 6.3. Design of polysilicon pressure transducer254
  • 6.4. Offset voltage and temperature coefficient of offset256
  • 6.5. Temperature coefficient of sensitivity262
  • 6.6. Nonlinearity265
  • 6.7. Calibration of pressure transducers274
  • References279
  • Chapter 7. Piezoresistive accelerometers281
  • 7.1. Cantilever beam accelerometers281
  • 7.2. Quad-beam accelerometer295
  • 7.3. Twin-mass accelerometer306
  • 7.4. Lateral accelerometers313
  • References317
  • Chapter 8. Capacitive pressure transducers and accelerometers319
  • 8.1. Capacitive pressure transducers319
  • 8.2. Open loop capacitive accelerometers325
  • 8.3. Force-balanced accelerometers333
  • 8.4. Thermo-mechanical noise of mechanical structures350
  • References351
  • Chapter 9. Resonant sensors and vibratory gyroscopes353
  • 9.1. Resonant pressure transducers353
  • 9.2. Resonant accelerometers359
  • 9.3. Vibratory gyroscopes362
  • References370
  • Subject index373
Book details
  • Vendor Elsevier S & T
  • SKU 9780444505583
  • ISBN-13 9780080524030
  • Author Bao, Min-hang
  • Category Technology & Engineering
  • Subject Technical & Manufacturing Industries & Trades

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Description eBook delivery & access Reviews
Some years ago, silicon-based mechanical sensors, like pressure sensors, accelerometers and gyroscopes, started their successful advance. Every year, hundreds of millions of these devices are sold, mainly for medical and automotive applications. The airbag sensor on which research already started several decades ago at Stanford University can be found in every new car and has saved already numerous lives. Pressure sensors are also used in modern electronic blood pressure equipment. Many other mechanical sensors, mostly invisible to the public, perform useful functions in countless industrial and consumer products.


The underlying physics and technology of silicon-based mechanical sensors is rather complex and is treated in numerous publications scattered throughout the literature. Therefore, a clear need existed for a handbook that thoroughly and systematically reviews the present basic knowledge on these devices.

After a short introduction, Professor Bao discusses the main issues relevant to silicon-based mechanical sensors. First a thorough treatment of stress and strain in diaphragms and beams is presented. Next, vibration of mechanical structures is illuminated, followed by a chapter on air damping. These basic chapters are then succeeded by chapters in which capacitive and piezoresistive sensing techniques are amply discussed. The book concludes with chapters on commercially available pressure sensors, accelerometers and resonant sensors in which the above principles are applied.


Everybody, involved in designing silicon-based mechanical sensors, will find a wealth of useful information in the book, assisting the designer in obtaining highly optimized devices.