WDM Technologies: Active Optical Components: Active Optical Components
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Table of contents
- DedicationCover
- Table of Contentsvii
- ContributorsCover
- ForewordCover
- AcknowledgmentsCover
- Chapter 1: OverviewCover
- 1.1. ProspectusCover
- 1.2. Organization and Features of the VolumesCover
- 1.3. Survey of Volume ICover
- ReferencesCover
- Part 1: Laser SourcesCover
- Chapter 2: Long-Wavelength Laser SourceCover
- 2.1 Introduction13
- 2.2 Laser Designs14
- 2.3 Quantum Well Lasers20
- 2.4 Distributed Feedback Lasers30
- 2.5 Surface-Emitting Lasers38
- 2.6 Laser Reliability44
- 2.7 Integrated Laser Devices48
- 2.8 Summary and Future Challenges53
- References54
- Chapter 3: High Power Semiconductor Lasers for EDFA Pumping59
- 3.1. Introduction59
- 3.2. High Power Semiconductor Lasers62
- 3.3. 1480nm Lasers69
- 3.4. 980nm Lasers91
- 3.5. Laser Modules95
- 3.6. Future Prospects97
- Acknowledgments99
- Appendix99
- References102
- Chapter 4: Tunable Laser Diodes105
- 4.1. Electronic Frequency Control106
- 4.2. Characteristics of Tunable Lasers116
- 4.3. Distributed Bragg Reflector Laser121
- 4.4. Increasing the Tuning Range of DBR-Type Lasers126
- 4.5. External Cavity Tunable Lasers146
- 4.6. Selectable Sources and Arrays150
- 4.7. Integration Technology154
- 4.8. Comparison of State-of-the-Art Tunable Lasers157
- References159
- Chapter 5: Vertical-Cavity Surface-Emitting Laser Diodes167
- 5.1. Introduction167
- 5.2. Scaling Laws170
- 5.3. Device Structures and Dcsign174
- 5.4 Surface-Emitting Laser in Long Wavelength Band178
- 5.5. Surface-Emitting Laser in Mid-Wavelength Band181
- 5.6 Surface-Emitting Lasers in Near Infrared-Red Band186
- 5.7. Surface-Emitting Lasers in Green-Blue-UV Band188
- 5.8. Innovating Technologies189
- 5.9. VCSEL-Based Integration Technology192
- 5.10 VCSEL Application to WDM Networks194
- 5.11. Summary196
- Acknowledgments197
- References197
- Part 2: Optical ModulatorsCover
- Chapter 6: Lithium Niobate Optical Modulators207
- 6.1. Introduction and Scope207
- 6.2. Optical Modulation209
- 6.3. Basic Principles of the Modulator Design and Operation212
- 6.4. Modulator Fabrication Methods and Reliability234
- 6.5. Summary and Conclusion242
- References242
- Chapter 7: Electroabsorption Modulators249
- 7.1. Introduction249
- 7.2. Electroabsolption253
- 7.3. EA Modulator Design264
- 7.4. EA Modulator Characterization278
- 7.5. Electroabsorption Modulators Integrated with Lasers296
- 7.6. Advanced EA Modulator Designs304
- 7.7. Summary313
- References313
- Part 3: PhotodetectorsCover
- Chapter 8: P-I-N Photodiodes317
- 8.1. Introduction317
- 8.2. Basic Photodiode Concepts, Design, and Requirements for Use in Optical Fiber Communications319
- 8.3. Frequency-Photoresponse Calculations329
- 8.4. Current Transport in InGaAs p+n-Junction338
- 8.5. Photodiodes347
- 8.6. Conclusion372
- References372
- Chapter 9: Avalanche Photodiodes379
- 9.1. Introduction379
- 9.2. Basic Design and Operation of Avalanche Photodiodes381
- 9.3. Germanium Avalanche Photodiodes398
- 9.4. InP/InGaAs Avalanche Photodiodes402
- 9.5. Studies of Novel APDs426
- 9.6. Conclusions433
- References434
- Part 4: Fabrication TechnologiesCover
- Chapter 10: Selective Growth Techniques and Their Application in WDM Device Fabrication443
- 10.1. Introduction443
- 10.2. Selective MOVPE446
- 10.3 Narrow-Stripe Selective MOVPE459
- 10.4 Application of Selective MOVPE in Fabricating WDM Light Sources481
- 10.5 Summary520
- Acknowlegment521
- References521
- Chapter 11: Dry Etching Technology for Optical Devices533
- 11.1. Introduction533
- 11.2. Dry Etching Equipment534
- 11.3. High Aspect Ratio Vertical Mirrors in Si535
- 11.4 Dry Etched Mirrors for Triangular Ring Lasers and Microcavities540
- 11.5. Nanostructures for Horizontal Distributed Bragg Reflector Mirrors544
- 11.6. Photonic Bandgap Lasers550
- 11.7. Effects of Dry Etching on Optical Properties554
- 11.8. Summary557
- Acknowledgment559
- References559
- Part 5: Optical Packaging Technologies563
- Chapter 12: Optical Packaging/Module Technologies: Design Methodologies565
- 12.1 Introduction565
- 12.2 Package Types566
- 12.3 Package Classifications567
- 12.4 Design Methodologies/Approaches568
- 12.5 Conclusions and Future Challenges in Optical Module Designing623
- References624
- Chapter 13: Packaging Technologies for Optical Components: Integrated Module629
- 13.1. Introduction629
- 13.2 Integrated Modules: Hybrid versus Monolithic630
- 13.3 Technology Requirements631
- 13.4. Different Packages639
- 13.5. Conclusions and Future Prospects660
- References662
- IndexCover
This book will be an excellent resource for engineers and researchers engaged in all aspects of fiber optics communication, such as, optoelectronics, equipment/system design, and manufacturing. The book is also a resource for graduate students and scholars interested in these rapidly growing fields.
· Provides the reader with insight and understanding for key active optical components frequently being / to be used in the optical communication systems, essential building blocks of today's/next generation fiber optic networks
· Allows engineers working in optical communication area, (from system to component) to understand the principle and mechanics of each key component they deal with for optical system design
·Covers different laser diodes as transmitter and pumping sources, different modulators, and different photodetectors
· Provides the reader with insight and understanding for key active optical components frequently being / to be used in the optical communication systems, essential building blocks of today's/next generation fiber optic networks
· Allows engineers working in optical communication area, (from system to component) to understand the principle and mechanics of each key component they deal with for optical system design
·Covers different laser diodes as transmitter and pumping sources, different modulators, and different photodetectors